- Manufacturer：
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- Thickness：
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- Material：
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- Adhesive：
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- Thermal Conductivity：
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- Backing, Carrier：
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8 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
1,806
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
8,665
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
1 |
8,665
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
6 |
8,665
In-stock
|
Get Quote | ||
|
|
t-Global Technology | THERM PAD 21.84MMX1... |
3 |
8,665
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
8,665
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
8,665
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 21.84MMX1... |
1 |
8,665
In-stock
|
Get Quote |
